Hais txog Sibranch Microelectronics
Founded hauv 2006 thiab headquartered nyob rau hauv Ningbo, Tuam Tshoj, Sibranch Microelectronics yog tsim los ntawm ib pab neeg ntawm cov ntaub ntawv science kws txawj nrog tob hauv paus hauv lub semiconductor kev lag luam. Peb lub luag haujlwm yog xa cov khoom zoo tshaj - cov khoom siv hluav taws xob semiconductor thiab cov kev pabcuam cuam tshuam rau cov neeg siv khoom thoob ntiaj teb.
Peb Cov Khoom Muag
Peb tshwj xeeb hauv kev nthuav dav ntawm silicon wafers, suav nrog:
- Txheem ib zaug - sab polished (SSP) thiab ob - sab polished (DSP) wafers
- Test wafers thiab qib prime wafers
- Silicon-ntawm-Insulator (SOI) wafers
- Coinroll wafers
- Txoj kab uas hla muaj txog li 12 ntiv tes
- Txoj kev loj hlob: CZ, MCZ, thiab FZ
- Cov kev xaiv kev cai: Neutron irradiation, ib qho kev taw qhia crystallographic, tawm - txiav substrates, dav resistivity ranges (siab & qis), ultra-pav, ultra- nyias, thiab tuab wafers
Tus nqi -Cov Kev Pab Ntxiv
Tshaj li wafer mov, peb pab neeg muaj kev paub dhau los muab kev ua haujlwm siab tshaj plaws:
- Nyias zaj duab xis deposition (Oxide, Nitride, Hlau txheej)
- Silicon epitaxial kev loj hlob thiab kev pabcuam epitaxy (SOS, GaN, GOI, thiab lwm yam)
- Wafer thinning, rov qab sib tsoo, thiab dicing
Tshwj xeeb Wafers
Peb kuj muab ntau yam tshwj xeeb crystalline substrates:
- Sapphire wafers: 2" mus rau 8", muaj nyob rau hauv A- dav hlau, R- dav hlau, M- dav hlau, C- dav hlau nrog epi- polishing thiab zoo sib tsoo xaiv
- GaAs wafers: 2" to 8", P-type, N-type, semi{4}}conducting, thiab semi-insulating qib
- SiC wafers: 4" to 12", 4H-N, 6H-N, and 6H-SI polytypes
- iav wafers: 1 "mus rau 12", Fused Silica, Borofloat, thiab B270 cov ntaub ntawv
- Ib leeg siv lead ua quartz wafers: 2" txog 6", X-txiav, Y-txiav, thiab Z- txiav kev taw qhia
