Fused Silica Wafer

Fused Silica Wafer

Fused silica wafers yog dav siv los ua substrates rau kev tso tawm ntawm cov yeeb yaj kiab nyias rau cov khoom siv semiconductor thiab lwm yam kev siv high-tech. Lawv cov purity siab thiab tsis muaj qhov tsis xws luag ua rau lawv zoo tagnrho rau kev tsim cov khoom siv hluav taws xob, xws li microprocessors, nco chips, thiab sensors.
Xa kev nug
Tsham tam sim no
Hauj lwm lawm
Kev tsis
Product Description

 

Fused silica wafers yog dav siv los ua substrates rau kev tso tawm ntawm cov yeeb yaj kiab nyias rau cov khoom siv semiconductor thiab lwm yam kev siv high-tech. Lawv cov purity siab thiab tsis muaj qhov tsis xws luag ua rau lawv zoo tagnrho rau kev tsim cov khoom siv hluav taws xob, xws li microprocessors, nco chips, thiab sensors.

 

Tsis tas li ntawd, fused silica wafers kuj tseem siv rau hauv kev tsim khoom ntawm MEMS (microelectromechanical systems) cov khoom siv, uas yog cov khoom tseem ceeb hauv ntau yam khoom siv hluav taws xob, suav nrog smartphones thiab wearables. Lawv cov khoom tshwj xeeb, suav nrog lub zog siab, yoog raws, thiab ua haujlwm ntev, ua rau lawv zoo tagnrho rau siv hauv cov ntawv thov no.

 

Khoom siv

Loj

Thickness

Refractive Index

Khoom ntom ntom

Kev nthuav dav

Young's modulus Knoop

Khob hardness

Chav tsev

mm

mm

nd (20 degree)

g/cm3

(20-300 degree)

kN / hli 2

HK0.1/20

BOROFLOAT 33

1150 x 850

0.7 - 25.4

1.4714

2.2

3.25 x 10-6 K-1

64

480

D 263T Eco

440 x 360

0.1 - 1.1

1.5231

2.51

7.2 x 10-6 K-1

72.9

590

B 270i

258 x 406

0.7 - 17

1.523

2.56

9.4 x10-6 K-1

71.1

500

 

Wafer

Qhov ntau thiab tsawg:

Feem ntau ntawm 1 nti mus rau 4 nti

Thickness:

Feem ntau {{0}}.5mm thiab 1.0mm

Clear Aperture:

Central 90% ntawm txoj kab uas hla

Flatness:

Los ntawm 1/4th nthwv dej mus rau 2 nthwv dej

Parallelism:

Los ntawm 5 arcsec mus rau 15 arcsec

Nto Zoo:

10-5 thiab 20/10

Ruam:

5 angstrom rau 10 angstrom

Khoom siv:

Quartz, LiTaO3, LiNbO3, MgO doped LiNb

 

Qhov rai

Qhov ntau thiab tsawg:

4mm txog 300mm

Thickness:

Los ntawm 0.3mm mus rau 30mm

Clear Aperture:

Central 90% ntawm txoj kab uas hla

Flatness:

1/10th Wave

Parallelism:

1 arcs

Nto Zoo:

20-10 los yog zoo dua

Cov duab:

Lub voj voog, duab plaub thiab cov duab tshwj xeeb

Khoom siv:

Optical tsom iav, Fused Silica, B270, D263T, BOROFLOAT 33

 

Khoom duab
DSC01212001
001
Vim Li Cas Xaiv Peb

 

Peb cov khoom yog sourced tshwj xeeb los ntawm lub ntiaj teb no sab saum toj tsib manufacturers thiab ua domestic factories. Kev txhawb nqa los ntawm cov kws tshaj lij hauv tsev thiab thoob ntiaj teb cov kws tshaj lij pab pawg thiab kev tswj xyuas nruj.

Peb lub hom phiaj yog los muab cov neeg siv khoom nrog kev txhawb nqa ib leeg rau ib leeg, ua kom cov kev sib txuas lus zoo uas muaj kev tshaj lij, raws sijhawm, thiab ua haujlwm tau zoo. Peb muab qhov tsawg kawg nkaus txiav txim kom muaj nuj nqis thiab lav kev xa khoom sai hauv 24 teev.

 

Factory Show

 

Peb cov khoom lag luam loj muaj 1000+ cov khoom, kom ntseeg tau tias cov neeg siv khoom tuaj yeem xaj kom tsawg li ib thooj. Peb tus kheej cov khoom siv rau dicing & backgrinding, thiab tag nrho kev koom tes nyob rau hauv lub ntiaj teb no kev lag luam saw pab kom peb sai li sai tau cov zaub mov xa tuaj kom ntseeg tau tias cov neeg siv khoom txaus siab thiab yooj yim.

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Peb Daim Ntawv Pov Thawj

 

Peb lub tuam txhab txaus siab rau ntau daim ntawv pov thawj peb tau txais, suav nrog peb daim ntawv pov thawj patent, ISO9001 daim ntawv pov thawj, thiab daim ntawv pov thawj National High-Tech Enterprise. Cov ntawv pov thawj no sawv cev rau peb txoj kev mob siab rau kev tsim kho tshiab, kev tswj xyuas zoo, thiab kev cog lus rau kev ua tau zoo.

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Cim npe nrov: Tuam Tshoj fused silica wafer, Tuam Tshoj fused silica wafer manufacturers, lwm tus neeg, Hoobkas