Wafer Resizing / Coring txheej txheem
Cov txheej txheem uas txiav loj dua - kab txaij wafers rau hauv me me - wafers loj, feem ntau yog siv rau qhov tshwj xeeb qhov yuav tsum tau muaj, qauv npaj, los yog tsawg- ntim ntau lawm.
Ntug Rounding / Beveling txheej txheem
Ib txheej txheem uas grinds thiab polishes wafer npoo kom tshem tawm chipping thiab microcracks generated thaum lub sij hawm dicing, yog li txhim kho cov neeg kho tshuab zog ntawm wafers. Nws yog feem ntau ua raws li cov kauj ruam tom ntej rau cov txheej txheem wafer resizing.
Raws li ib feem ntawm peb cov txheej txheem resizing, peb kuj muab precision ntug rounding (ntug beveling) cov kev pab cuam tshem tawm ntug chipping, microcracks, thiab kev ntxhov siab concentrations, ho txhim kho wafer mechanical zog thiab ua yield.
Peb niaj hnub ua wafers nyob rau hauv tag nrho cov qauv diameters: 2 "(50 mm), 3" (75 mm), 4 "(100 mm), 5" (125 mm), 6" (150 mm), 8 "(200 mm), thiab 12" (300 mm), nrog rau kev cai ntau thiab tsawg muaj raws li qhov kev thov.

Muaj peev xwm
Cov hauv qab no yog peb wafer resizing peev xwm:
Txheej txheem wafer txoj kab uas hla mus txog 300mm
Cov txheej txheem wafers nyias li 0.150mm
Ua tiav tiav resized wafers nyob qhov twg los ntawm 50mm mus rau 200mm
Ua ntau yam wafers los ntawm ib qho wafer. Piv txwv li, peb tuaj yeem tsim ob 100mm wafers los ntawm ib qho 200mm wafer.
Ua SEMI- tus qauv tiaj tus +/- 0.002 degrees
Tsim SEMI-tus qauv thais hauv cov wafers
Tolerance ntawm +/- 0.100mm ntawm OD dimension
Kev kam rau siab ntawm +/- 0.050mm ntawm qhov chaw nruab nrab
Offset lub wafer center kom maximize qhov tuag yield
Laser sau tus wafer ID ntawm lub wafer resized rau wafer tus kheej tswj
Wafer ntug rounding / beveling
High -purity deionized (DI) dej sib tsoo cov dej txias
Txiav, nyias, los yog kauj ruam ntug ntawm resized wafers
Dice tiav tuag los ntawm cov seem ntawm thawj wafer












